Semiconductor Assembly and Testing Services Market to Reach US$52.1 Billion by 2029 – Comprehensive IMF Research Report
DUBAI, United Arab Emirates, April 05, 2022 (GLOBE NEWSWIRE) — The continued developments and implementation of new technologies such as organic substrate interposition technology and interconnect via silicon technology in the service market Semiconductor Assembly and Testing Services are generating significant revenue opportunities for players in the Semiconductor Assembly and Testing Services market.
|Market value 2022||US$34.5 billion|
|Market value 2029||US$52.1 billion|
|Share of top 5 players||20%|
Implementing semiconductor assembly and testing services in the consumer electronics industry helps manufacturers produce semiconductors, memory chips, and wafers used in consumer electronics products and cordless/mobile handsets more efficiently.
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Profiled Key Companies
- ASE Group, Inc.
- Amkor Technology, Inc.
- Siliconware Precision Industries Co., Ltd.
- Powertech Technology, Inc.
- United Test and Assembly Center Ltd.
- JCET Group Co Ltd
- ChipMOS Technologies
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Chipbond Technology Corporation.
- Global Foundries Inc.
- CORWIL Technology Corp.
- Thinklogical (Belden Inc.)
- Tripp Lite
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The value of the global semiconductor assembly and testing services market is expected to witness a 6.1% CAGR during the forecast period of 2022-2029.
Key Insights from Semiconductor Assembly and Testing Services Market Research
- Among the application segment, the consumer electronics segment is expected to witness a high growth rate, owing to the increasing demand for audio/video equipment, cameras, calculators and smart homes (equipments and accessories home security)
- The Asia-Pacific ex-Japan region is expected to create lucrative growth opportunities for players in the semiconductor assembly and testing services market, driven by rapid growth in semiconductor packaging and increasing applications semiconductor assembly methodologies in this region
- Growing demand for connected devices worldwide, including smartphones and tablets with connectivity and multimedia capabilities, is driving demand for superior packaging technologies and creating growth opportunities for service providers in the market for semiconductor assembly and testing services.
“Semiconductor assembly and test service providers can improve revenue by upgrading existing facilities to include superior electrical and thermal performance and high input and output capabilities,” says IMF analyst
Gains confirmed by growing demand for improved connectivity in consumer electronics
The increased demand for mobile and connected devices such as tablets and smartphones has boosted the demand for more advanced packaging technologies. Additionally, the growing demand for digital video content is driving the growth of high-performance mobile consumer electronics products, such as Wi-Fi chipsets and other semiconductor chips.
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For example, STATS chipPAC (JCET) is developing an Extended Wafer-Level Chip Scale Package (eWLCSP), which offers enhanced testing and a low-cost breakdown wafer-level package for wafer-controlled mobile devices. space.
Additionally, the growth of end-use industries such as electronics and semiconductors, automotive, manufacturing and packaging is expected to provide potential growth opportunities for manufacturers in the global assembly services market and semiconductor testing.
ODMs and OEMs prioritize “Fab-lite” strategy
As semiconductor processing technology migrates to larger wafers and smaller feature sizes, the cost of building state-of-the-art wafer fabs has risen dramatically, reaching into the billions of dollars. dollars. High capital costs for next-generation silicon technology and equipment are driving various semiconductor companies to adopt or maintain a “fabless” or “fab-lite” strategy. Growing demand for semiconductors is required for cloud integration and connectivity, including sensors, computing, interactivity, and communication devices.
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Semiconductor Assembly and Testing Services Market Outlook by Category
By Services, the Semiconductor Assembly and Testing Services market demand is segmented as follows:
- Assembly and packaging services
- Binding of copper wires and gold wires
- flip the chip
- Slice packaging
- Testing services
By Application, the Semiconductor Assembly and Testing Services market outlook is segmented as follows:
- IT and networks
- Consumer electronics
- Automotive electronics
By Region, the Semiconductor Assembly and Testing Services Market is segmented as follows:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia-Pacific excluding Japan
- Middle East and Africa (MEA)
More Valuable Insights into Semiconductor Assembly and Testing Services Market
The IMF Semiconductor Assembly and Testing Services market report is segmented into three major sections such as services (assembly and packaging services (connection of copper wire and gold wire, flip chip, wafer-level packaging, TSV, others) and testing services), applications (communications, computing and networking, consumer electronics, industrial and automotive electronics, and region to help readers understand and evaluate the opportunities lucrative markets for semiconductor assembly and testing services.
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